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267 results found
E3.HarnessAnalyzer Interactive Demo
  • Software Evaluation
septembre 10, 2025
E3.HarnessAnalyzer Interactive Demonstration

E3.HarnessAnalyzer is a powerful tool for viewing and analyzing wire harness drawings in the HCV container data format.

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Watch as 25+ movies guide you through the E3.HarnessAnalyzer functionality
Extract ECAD design data from MCAD designs
  • Software Evaluation
septembre 10, 2025
E3.3DTransformer Demo

E3.3DTransformer is designed to convert 3D MCAD models into electrical designs, offering an interactive demonstration and tutorial upon registration.

Interactive Tour
Take the 10 minute interactive evaluation
e3-splash-screen-2026-20250805-510x310
  • Press Release
septembre 09, 2025
E3.series Release 2026

Zuken a annoncé les détails de la nouvelle version E3.series 2026, qui introduit de puissantes fonctionnalités destinées à optimiser la conception électrique et fluidique, à renforcer la collaboration interdisciplinaire et à accroître de manière significative la productivité en ingénierie.

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JOINT3_logo_TN-510x310
  • Press Release
septembre 04, 2025
Participating in “JOINT3” Consortium to Develop Next-Generation Semiconductor Packaging

Zuken Inc. has joined the JOINT3 consortium—an industry co-creation platform led by Resonac to accelerate the development of next-generation semiconductor packaging materials, equipment, and design tools for panel-level organic interposers—where Zuken will contribute its CR-8000 Design Force expertise to help demonstrate, optimize, and evolve design and manufacturing processes that address the growing demand for 2.xD and 3D semiconductor packages in applications such as generative AI and autonomous driving.

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zuken_CorporateProfile-2025-510x310
  • Brochure
août 26, 2025
Corporate Profile Report 2025

Our strategy, solutions, financial performance, and customer success stories showcase how Zuken is shaping the future of engineering. The report combines key financial highlights with insights into how leading organizations are using our technologies to accelerate innovation.

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Management Report and Vision - Zuken Inc, Yokohama
MA_8981-510x310
  • Press Release
août 22, 2025
Zuken ouvre un nouveau centre de développement pour E3.series

Zuken ouvre un nouveau centre de développement pour E3.series à Neu-Ulm, Allemagne

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Genesys_2025-510x310
  • Press Release
juin 10, 2025
GENESYS Advances Interoperability and Usability in Model-Based Systems Engineering

This latest release of GENESYS 2025 focuses on enhancing model structure, streamlining interoperability between tools, and accelerating the adoption of key industry standards that are vital for designing large-scale mission-critical and enterprise systems.

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2025-04-22-10_16_03-Greenshot-510x310
  • Press Release
mai 08, 2025
Zuken lance le CR-8000 2025 avec un support renforcé par l’IA pour la conception de circuits imprimés à haute vitesse et à haute densité

Explore CR-8000 2025’s latest AI and simulation upgrades for faster, more reliable schematic and layout design—optimized for high-speed, high-density electronics.

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What's New eCadstar 2025
  • Press Release
avril 30, 2025
eCADSTAR 2025:boostez votre conception PCB avec des workflows intelligents et une intégration manufacturing optimisée

Les nouvelles fonctionnalités simplifient la gestion des bibliothèques, améliorent la précision des conceptions à haute vitesse et optimisent la documentation et les processus de fabrication pour pour une performance maximale

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Z0603-IBM-Research-AI-Hardware-Center-3-510x310
  • Press Release
mars 24, 2025
Zuken rejoint le IBM Research AI Hardware Center pour développer des solutions matérielles de prochaine génération pour l’intelligence artificielle.

Zuken a signé un accord de développement conjoint avec IBM pour innover dans l'intégration 3D des circuits, accélérer le hardware pour AI et optimiser les workflows EDA. Cette collaboration se concentre sur l'intégration hétérogène de puces, l'évaluation des accélérateurs d'apprentissage profond, let les tests de fiabilité. Ce partenariat souligne l'engagement de Zuken à stimuler l'innovation dans la conception de puces alimentées par l'IA et les solutions de packaging de semi-conducteurs de prochaine génération.

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AI Based PCB Place and Route
  • Webinar
mars 21, 2025
AI-Based PCB Place and Route

CR-8000 Webinar: Zuken recently announced the upcoming release of the industry’s first AI-based PCB place and route product - Autonomous Intelligent Place and Route (AIPR) - This webinar will examine how companies and users will benefit.

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mbse-data-process-1024x576-1-510x310
  • White Paper
février 25, 2025
How to Leverage MBSE to Solve Critical Challenges in Discrete Manufacturing

This white paper introduces a solution that combines the innovative approach of Model-Based Systems Engineering (MBSE) with the best practice of managing data and processes in a PDM system.

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wire-harness-1600x500-1-510x310
  • Webinar
février 17, 2025
ECAD/MCAD Integration for Efficient Harness Design

Explore how Zuken’s E3.series integrates seamlessly with leading MCAD tools like Siemens' NX and Solid Edge, Dassault's CATIA V5 / V6 and SolidWorks, PTC’s Creo, and Autodesk’s Inventor for efficient harness design - includes a detailed demonstration of how Siemens NX can be integrated with E3.series.

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genesys-2024-zuken-vitech-510x271
  • Press Release
janvier 08, 2025
Zuken Vitech Unveils GENESYS 2024: Accelerating Systems Engineering with Advanced Capabilities
Press Release
Zuken Corporate Profile 2024
  • Brochure
novembre 04, 2024
Corporate Profile Report 2024

Download the latest Zuken Corporate Profile including statements from the Board and financial highlights.

DOWNLOAD
Management Report and Vision - Zuken Inc, Yokohama
blue-hard-and-soft-510x310
  • Webinar
octobre 16, 2024
Advanced Electronics Collaboration: Zuken DS-CR and Dassault Systèmes’ 3DEXPERIENCE Platform

Discover how Zuken’s CR-8000/DS-CR integrates with Dassault Systèmes’ 3DEXPERIENCE Platform, providing robust solutions for efficient data management and collaborative workflows between electrical and mechanical design teams.

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