PCB Reference Designs for Intel IoT Devices
Zuken Announces PCB Reference Design Availability for Intel IoT Devices
1 April 2015 – Munich, Germany and Westford, MA, USA – Zuken announces that board reference designs for Intel-produced Internet of Things (IoT) devices prepared in CR-8000 Design Force are now available from Intel. Delivery starts with the Intel® Atom™ Processor E3800 series of products.
Intel Corporation and Zuken are engaged in a technical partnership working to address convenience improvements for designs in Zuken PCB design environments that use Intel platforms. This delivery of reference designs forms just one part of these efforts.
With the continued rise of IoT, it is becoming increasingly important for products developed by embedded system manufacturers to incorporate highly advanced designs using the latest electronic components in the shortest period of time. Embedded system manufacturers using Intel platforms can greatly reduce the time required for design reviews by obtaining the reference design in Zuken PCB design formats.
This initiative will greatly improve the efficiency of embedded systems designs based on Intel® Architecture (IA). Intel and Zuken plan to continue their collaboration to enhance design efficiency for developers, while providing optimal IA solutions for the emerging IoT market.
For further information, see www.zuken.com/design-force
Note
Intel, the Intel logo and Intel Atom are trademarks of Intel Corporation in the United States and other countries. Other company names and product names etc. are generally the trademarks and registered trademarks of the respective countries.
– ends –
- Press Release
Zuken Inc. has joined the JOINT3 consortium—an industry co-creation platform led by Resonac to accelerate the development of next-generation semiconductor packaging materials, equipment, and design tools for panel-level organic interposers—where Zuken will contribute its CR-8000 Design Force expertise to help demonstrate, optimize, and evolve design and manufacturing processes that address the growing demand for 2.xD and 3D semiconductor packages in applications such as generative AI and autonomous driving.
- Press Release
Explore CR-8000 2025’s latest AI and simulation upgrades for faster, more reliable schematic and layout design—optimized for high-speed, high-density electronics.
- Products
La version 2025 de CR-8000 apporte des workflows de simulation améliorés, une co-conception 3D multi-cartes renforcée, un routage assisté par IA étendu et une synchronisation PLM plus étroite.
- Press Release
Zuken a signé un accord de développement conjoint avec IBM pour innover dans l'intégration 3D des circuits, accélérer le hardware pour AI et optimiser les workflows EDA. Cette collaboration se concentre sur l'intégration hétérogène de puces, l'évaluation des accélérateurs d'apprentissage profond, let les tests de fiabilité. Ce partenariat souligne l'engagement de Zuken à stimuler l'innovation dans la conception de puces alimentées par l'IA et les solutions de packaging de semi-conducteurs de prochaine génération.