Risultati ricerca per: PCB
- Comunicato Stampa
Zuken si è unita all'IBM Research AI Hardware Center per sviluppare soluzioni avanzate nel packaging 3DIC, nell'accelerazione hardware per l'AI e nell'ottimizzazione dei workflow EDA. La collaborazione si concentra sull'integrazione eterogenea dei chip, sulla valutazione degli acceleratori per deep learning, sullo sviluppo di materiali innovativi e sui test di affidabilità. Questa partnership evidenzia l'impegno di Zuken nell'innovazione nella progettazione di chip basata sull'intelligenza artificiale e nelle soluzioni di packaging per semiconduttori di nuova generazione.
A two‑day workshop where hardware engineers and SI specialists master Gen2 signal integrity through classroom instruction, hands‑on labs and software‑driven exercises.
- Comunicato Stampa
Zuken Inc. has joined the JOINT3 consortium—an industry co-creation platform led by Resonac to accelerate the development of next-generation semiconductor packaging materials, equipment, and design tools for panel-level organic interposers—where Zuken will contribute its CR-8000 Design Force expertise to help demonstrate, optimize, and evolve design and manufacturing processes that address the growing demand for 2.xD and 3D semiconductor packages in applications such as generative AI and autonomous driving.
- Case Study
Data conversion as a foundation for a future-oriented development process in electrical and pneumatic control technology. Zuken Migration Services converts 18,000 data records for Windmöller & Hölscher, the world market leader in machines and systems for manufacturing and processing flexible packaging.
- Webinar
Zuken and SiliconExpert have partnered to deliver critical component information within CR-8000 and DS-CR design and library data environments. Make more informed component selection decisions and review part information, resulting in higher quality products and lower overall costs in less time.