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CR-8000 - Advanced PCB Design Software
CR-8000 is a suite of applications that span the entire PCB engineering lifecycle: from architecture planning through system level engineering and optimization, to physical implementation and manufacturing.
CR-8000 is the only PCB design environment complemented by data management capabilities, providing comprehensive library, module, configuration and release management.
TRUSTED BY CUSTOMERS
CR-8000 - from architectural planning to physical implementation
CR-8000 is a product-centric electronic system design solution that provides the tools to optimize a design at both the IC and PCB design level. Product-centric design processes provide architectural validation of the design against product requirements. Product-centric detailed design includes 2D/3D multi-board design and implementation, FPGA I/O optimization, chip/package/board co-design, and 3D MCAD integration all in one design process.
Partition complex systems into multiple connected PCBs
Manage IC, package and PCB in one single environment
Control releases, revisions and configurations with integrated data management
Take the CR-8000 Product Tour
Successful companies are building highly competitive products, smaller, lighter, and more functional. As products evolve, the design process evolves too: Shifting from a PCB-centric focus to and end-to-end approach combining hierarchical multi-board design, 3D multiboard PCB design, FPGA optimization and IC package design, SI analysis, PI analysis and comprehensive PCB manufacturing outputs into one consistent environment
From Concept to Manufacturing
The CR-8000 suite is the only concept-to-manufacturing, multi-board design tool suite that has been developed from the start to address the unique requirements of today’s ever-increasing challenges in system-level design optimization.
The suite’s fully integrated design flow ranges from initial system planning, where critical design decisions are made about design partitioning, schematic capture, and circuit design and simulation, through to multi-board PBC layout with comprehensive design-for-manufacturing capabilities for optimized manufacturing outputs.
Platform Features
System Level - from Concept to Manufacture
Functional design
CR-8000 is a comprehensive engineering and design environment that enables engineer to define and validate the architecture of new designs on a functional level using a mix of functional blocks that can be referenced to existing schematics
System circuit engineering
Ensure design integrity and manufacturability with embedded simulation and analysis tools and powerful design rule checks
Central constraint management
Save time and eliminate errors through centrally managed rules and constraints
2D/3D multi-board design
Manage multiple board designs as a coherent system within the boundaries of their mechanical enclosures.
Chip package and PCB co-design
Create and optimize the layout of system-in-package (SiP), package-on-package (PoP) and package-in-package (PiP) assemblies in 2D and 3D in their target PCB environment
Library and Design Data Management
Control releases, revisions and configurations with an integrated data management environment.
Why Renishaw choose to work with Zuken
CR-8000 Product Overview
- Products
October 01, 2018
System Planner
Architecture Design and Validation
- Products
October 01, 2018
Design Gateway
System Level Circuit Engineering
- Products
October 01, 2018
Design Force
3D Multi-board PCB Design
- Products
January 03, 2019
Design Force Advanced Packaging
IC Package and PCB Co-design
- Products
October 01, 2018
DFM Center
PCB Design for Manufacturing
- Products
October 01, 2018
DS-CR
PCB Design Data Management
Just some of our satisfied CR-8000 customers
Find out more about our advanced PCB design software
Check out our latest webinars, white papers, blog posts, tech tips & more
- Webinar
July 06, 2020
Practical Signal Integrity and EMI Control
In our webinar we will provide an introduction to the challenges of signal integrity and the underlying physical effects. This will provide the basis for practical tips to address the related challenges during PCB design.
WATCH NOW
LIVE Webinar: September 3rd 2020, 2pm UK / 3pm CEST
- Webinar
November 15, 2019
How to be First to Market with DDR5!
DDR5 is the latest generation of memory. In this joint webinar with Keysight Technologies, we’ll begin with pre-layout simulation, then transition to CR-8000. The design will then be verified by Electromagnetic (EM) simulation and system simulations in Keysight ADS, in order to build confidence in the final DDR5 design.
WATCH NOW
- Webinar
April 25, 2019
Practical Signal Integrity for improved EMI Control in PCB Design
The fast signal switching times of today’s digital systems require particular attention to the signal integrity during design to ensure reliable operation and EMI control
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- Webinar
December 12, 2018
Releasing Your Design to PLM is more Complicated than You Thought
This webinar will discuss the different release profiles from work-in-progress to a manufacturing-centric PLM system followed by the demonstration of best practices that can make the job easier and more reliable.
WATCH NOW
- White Paper
December 12, 2018
Report: Design Data Management
A survey of 163 companies in Germany, Austria and Switzerland about the challenges and methods applied to the design and management of electrical and electronic systems and assemblies
Read now
Results of an industry survey of electrical and electronic engineers
- Webinar
November 28, 2018
Avoiding Poor FPGA I/O Assignments with a PCB Co-design Process
The webinar will explore various points in the design flow where co-design of the FPGA or other programmable devices and board layout can take place
WATCH NOW
CR-8000 News
Read about the latest CR-8000 announcements
- Press Release
June 16, 2020
CR-8000 2020
Key development themes for CR-8000 2020 are superior design efficiency, comprehensive system-level design and verification, and support for the latest advancements in packaging technology.
Read now
FPGA optimization, skew group routing, back-drilled vias, electro-mechanical co-design,flex-rigid PCBs, multi-domain analysis, tile bump, 3D wire desi...
- Press Release
May 22, 2019
Zuken joins the UCLA CHIPS consortium
Press Release, Design Force Advanced Packaging
- Press Release
August 21, 2018
Polar Speedstack PCB Stackup Interface
Press Release, Design Force, DFM Center, Design Force Advanced Packaging