IMAPS Device Packaging 2020

16th International Conference and Exhibition on DEVICE PACKAGING

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within the industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

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Be sure to attend our conference sessions:

March 4, 4:00 pm: Prototyping IoT modules and assembling by additive manufacturing

March 4, 4:30 pm: Making a decision for System In Package implementation in chip-let future

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