The 53rd International Symposium on Microelectronics, IMAPS 2020, will be hosted in a virtual environment from October 5-8.
The IMAPS 2020 organizing committee is excited to launch a Symposium experience that attendees, speakers, and exhibitors can safely enjoy from home. The theme Enabling a Connected World: Always On! is more relevant than ever as we debut this highly interactive online experience with truly global reach. Attendees can continue to expect the same valuable technical content as our in-person event, including:
- Live keynotes, panel session, and a feature workshop from Fraunhofer IZM
- Sixteen live professional development courses
- Five tracks and over 95 technical speakers and poster presentations available on-demand
- Face to face connections in the virtual exhibit hall
- Attendee to attendee networking opportunities
- And more!
Learn more about the program below!
Be sure to attend our conference session on October 6:
Invited Session: Co-Design
Presentation Title: Evaluation of System In Package Implementation Options in the Chiplet World
Presenter: Steve Watt, Manager of Engineering Operations, SOZO Center at Zuken USA Inc.
Abstract: Evaluation of System In Package implementation options in the chiplet world. As wafer development costs become more expensive, die partitioning and stacking of devices are essential technologies along with the verification of signal performance. With the needed integration methods of these chiplets, System In Package (SiP) technologies like Wafer level package, 2.5D, 3D implementations become more and more significant. In this presentation, we explain how to quickly weigh your options on choosing the best SiP implementation, with emphasis on chip/package co-design, netlist management through to follow-up design modifications including die partitioning and seamless electrical characteristic verification during the design phase.