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Brochure Concise overviews of Zuken's product families and pre-packaged bundles for specific areas
Case Study Examples of successful deployments of Zuken technology in customer specific process landscapes Datasheet Detailed descriptions of Zuken software products Press Release Zuken company news, product announcements, partnerships and new customers Software Downloads of free try-out software and viewing tools Software Evaluation Evaluation Zuken Software Software Order Software Viewer Viewing and redlining tools for Zuken software products Webinar Library of recorded Zuken webinars for replay White Paper Industry issues, required capabilites and solution approaches

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98 results found

White Paper

October 12, 2018

The Internet of Things and Modular Design

White Paper, CR-8000

How the rise of IoT can lead to changes in the design process

release-to-manufacturing-process-1600-300-510x300

Webinar

October 12, 2018

Does the Release to Manufacturing Process Keep You up at Night?

Webinar, CR-8000, DS-2

endress-hauser-production-550x342-510x310

Case Study

October 01, 2018

Endress+Hauser

With PCB data and process management solutions from Zuken, Endress + Hauser has standardized development and manufacturing processes across five geographically-distributed operations, enabling company-wide parts standardization, design-reuse and increased engineering productivity.

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Endress+Hauser standardizes PCB engineering and production processes for industrial measurement products across distributed locations

Webinar

September 26, 2018

Improve Flex PCB Manufacturing Productivity with Better DFM Checks

Webinar, Design Force, ADM – Advanced Design for Manufacture

Case Study

September 26, 2018

Toshiba

Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phone they needed to shrink the board and the module thickness. On top of that, they had to add RF matching to simplify the adoption of the module. Toshiba used Zuken’s CR-8000 Design Force with ANSYS analysis tools to accomplish the project.

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significantly reduce product size with 3D chip, package, board co-design.