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Stay on the leading edge of PCB, electrical and data management technologies

25 results found
  • Webinar
September 14, 2020
EMC for PCB Designers

In this presentation, an EMC minded PCB design approach is presented, allowing designers to understand which EMC rules will apply to PCB projects and how EMC analysis capabilities can be utilized in the CAD flow to reduce the risk of EMC compliance failure once the board is manufactured.

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  • Webinar
July 06, 2020
Practical Signal Integrity for improved EMI Control in PCB Design

In our webinar we will provide an introduction to the challenges of signal integrity and the underlying physical effects. This will provide the basis for practical tips to address the related challenges during PCB design.

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  • Press Release
June 16, 2020
CR-8000 2020

Key development themes for CR-8000 2020 are superior design efficiency, comprehensive system-level design and verification, and support for the latest advancements in packaging technology.

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FPGA optimization, skew group routing, back-drilled vias, electro-mechanical co-design,flex-rigid PCBs, multi-domain analysis, tile bump, 3D wire desi...
  • Webinar
June 04, 2020
Constraint Specification in CR-8000

In this webinar the use of the Rule Stack Editor and Clearance Class in conjunction with the Constraint Browser will be explained step by step.

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  • Webinar
May 04, 2020
Advanced IC Packaging and Co-Design with Design Force
Webinar, Design Force Advanced Packaging, CR-8000
  • Webinar
November 15, 2019
How to be First to Market with DDR5!

DDR5 is the latest generation of memory. In this joint webinar with Keysight Technologies, we’ll begin with pre-layout simulation, then transition to CR-8000. The design will then be verified by Electromagnetic (EM) simulation and system simulations in Keysight ADS, in order to build confidence in the final DDR5 design.

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  • Webinar
November 28, 2018
Design PCBs using an engineering knowledge base

Repeating the same mistakes, missing key requirements, and failure to follow design guidelines all cost time and money. An engineering knowledge base that is tightly integrated with the PCB design process can be a key differentiator for your design team.

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  • Webinar
November 28, 2018
Electro-Magnetic Compatibility (EMC) Design Basics
Webinar, Design Force
  • Webinar
November 28, 2018
I/O Optimization with 3D SoC, SiP, and PCB co-design
Webinar, Chip-Package-Board Co-Design, Design Force, Design Force Advanced Packaging
  • Case Study
November 19, 2018
Renishaw

Flexible and flexi-rigid PCBs are integral components within many of Renishaw’s products, and detailed signal integrity analysis is needed to ensure high speed digital signals can be transmitted with minimal distortion. Renishaw migrated to Design Gateway and Design Force, part of Zuken’s CR-8000 PCB design suite, primarily to help with the design and analysis of next-generation flexible PCBs.

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Better fit and impedance control for complex flexible PCBs in metrology instruments.
  • Webinar
October 22, 2018
Avoid PCB and Enclosure Collisions with 3D Product Visualization
Webinar, Design Force
  • White Paper
October 20, 2018
Designing Products, Not Just Boards
White Paper, Design Force
The benefits of product-centric design and how it differs from current-generation PCB-centric processes and tools.
  • Webinar
October 20, 2018
3D PCB Multi-board Design Basics - Don't Fall Behind
Webinar, Design Force
  • White Paper
October 20, 2018
3D Convergence of Multi-board PCB and IC Packaging Design
White Paper, Design Force, Chip-Package-Board Co-Design, Design Force Advanced Packaging
Combine chips and boards in new configurations
  • Case Study
October 01, 2018
Endress+Hauser

With PCB data and process management solutions from Zuken, Endress + Hauser has standardized development and manufacturing processes across five geographically-distributed operations, enabling company-wide parts standardization, design-reuse and increased engineering productivity.

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Endress+Hauser standardizes PCB engineering and production processes for industrial measurement products across distributed locations