CR-5000 Library Add-on Tools
All multi-pin devices, including high pin-count FPGAs and CPLDs can be input via a spreadsheet or imported manufacturers' data using configurable rules. Symbols are then automatically generated based on property and pin data definitions, eliminating the need for manual drawing.
Pin data can be imported in formats such as ASCII and CSV files, and data can be exported in these formats or from the existing library parts. DRCs are available to ensure the required information is set for symbol generation and import to library. Within Component Designer, a pin data browser can be used to edit pin data and assignments in a spreadsheet-like environment.
Symbol splitting is useful for large, multi-pin components, such as ASICs or FPGAs, which may be too large to be easily drawn in a schematic. Symbol splitting can also make signal flow easier to visualize and understand. Schematics produced using this function can be used in System Designer and consistency can be maintained by netlist output and bi-directional annotation in Board Designer.
There is close integration with ASIC/FPGA design environments because symbol generation is supported for data outputs from language design environments such as Verilog and VHDL. Similarly, templates can be created from symbol and pin assignment data. Component Designer includes support for bidirectional exchange between Altera, Xilinx, Actel, and Lattice design systems with vendor specific pin report formats and pin constraint files that can also be exported to logical synthesis tools (Synplicity) as synthesis constraint conditions.
Wire Bond Generator
CR-5000 supports development of leading-edge IC packages featuring all types of wire-bond, flip-chip, and 3D mounting devices. Automatic generation, optimization and editing of bond shells can be carried out for multi-chip and stacked die packaging. This includes design rule checks for dies, wire-bond pads, ground rings and batch shape generation. Direct bonding between dies, bonding for shared wire-bond pads from dies with the same signal and other types of bonding are supported. During the automatic generation of bond shells, the position with the minimum bond wire length can be automatically found and both previews and real-time reports for minimum and maximum values can be displayed during the automatic generation of bond shells. Interactive bond-shell editing includes insertion, deletion, relocation, spacing, wiring spread, and other operations.
A set of customizable parameters can be used to search for components and the results can then be saved as a list or passed to other tools. A library viewer facilitates graphic display and printing different representations of product data sheets.