Suchergebnisse für: terms

0 Suchergebnisse
MAR 31, 2019
Terms and Conditions - CR-8000/CR-5000 (GER)
Hallbergmoos / Zuken GmbH, Germany
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JAN 1, 2019
Terms and Conditions- (FR)
Paris / France
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JAN 1, 2019
Terms and Conditions - E3.series (GER)
Ulm / Zuken E3 GmbH, Germany
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JAN 1, 2019
Terms and Conditions (CH)
Switzerland
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S-Parameters: Microwave goes Mainstream for High-Speed PCB Design Part 1
  • Blog
November 01, 2010
S-Parameters: Microwave goes Mainstream for High-Speed PCB Design Part 1

I’d like to explain to you in straightforward terms what S-Parameters are and why they’re so useful. When I say “straightforward”,  I mean that in a technical sense, but this is a specialised area. If you’re not designing high-speed PCBs, or you don’t know much about signal integrity, you might want to tune out now.

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So here goes. Mainstream high-speed PCB design has generally followed in the slipstream of RF and microwave engineering. This is often out of nece...
lock-circuits-featured-img-510x310
  • Blog
September 11, 2013
How to Protect PCB Design Intellectual Property

As companies benefit from the global supply chain in terms of lower production costs and faster turnaround times, they are also exposing their intellectual property to third parties, including PCB design data.

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It’s easy to get complacent about this topic, but it’s important to remember that a company’s IP is often the basis for its competitive adva...
Getting IoT Device Design Right for EMC and the 'Interference of Things'
  • Blog
September 27, 2018
Getting IoT Device Design Right for EMC and the 'Interference of Things'

As we welcome increasing numbers of IoT devices into our industries, offices and home lives, we shouldn’t be surprised to see increasing electromagnetic (EM) congestion. Or, as it’s now dubbed, the ‘Interference of Things’.

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As we welcome increasing numbers of IoT devices into our industries, offices and home lives, we shouldn’t be surprised to see increasing electro...
IoT
  • Blog
Oktober 25, 2018
Bridging the Gap between the Maker Movement and Mass Production Technology with IoT and the Trillion-Node Engine

Japan is one of the first countries to face the combination of challenges such as energy issues, population decline and an aging society. Solving these problems with the benefit of the Internet of Things (IoT) could generate future business opportunities as well as meeting the demands of society. Enabling as many people as possible to try out new ideas, and encouraging them to develop diverse products, will broaden these opportunities. The Trillion-Node Engine is a platform for realizing this objective.

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Complex-Chalkboard-2000x969-510x310
  • Blog
Dezember 31, 2018
Mitigating Board Complexity with System-level Engineering

Demand for faster data speeds is increasing. Boards are becoming more dense. Requirements call for the latest protocols and devices. Packaging constraints call for multi-board and flex-board systems. The surest sign of escalating board complexity lies in the fact that few are designed by a single engineer. Today, most require the coordination of many engineers instead. And overall, this trend shows no sign of abating. Board complexity looks like it will only get worse...

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There’s no doubt that board systems are getting more complex. System-level engineering can help mitigate those risks. One of the main advantages...
iStock-1018474784-e1549030959960-510x310
  • Blog
Februar 21, 2019
Inside Signal Integrity: Impedance Control - Part 1

Impedance and impedance control belong to the oldest and most often discussed topics in PCB design. They are especially important with the high-speed design when related to signal integrity. In this, the first of a two-part blog, we’ll go back to the basics of impedance/impedance control and consider what influences line impedance. In part two, we’ll set about controlling it.

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pciv-featured-img-510x310
  • Blog
Januar 19, 2017
Using Vias to Maintain PCB Signal Integrity Featuring High-Speeds in a 3D Environment

This is the second in my series of blog posts looking at the challenge of maintaining PCB signal integrity with now-common ultra-high speeds and growing adoption of PCB design environments to design in true 3-D. Today I focus on vias and the use of return vias to overcome the issues highlighted in Part 1.

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This is the second in my series of blog posts looking at the challenge of maintaining PCB signal integrity with now-common ultra-high speeds and g...
Zuken Helps French Automotive and Special Vehicle Supplier
  • Blog
Februar 01, 2018
Zuken Helps French Automotive and Special Vehicle Supplier Increase Global Turnover while Maintaining Quality

Several years ago, automotive supplier EFA France realised they were expanding at a rate beyond which their current electrical design setup could manage. With plans to increase their global turnover, while maintaining the high level of quality in their products that had caused their business to prosper in the first place, they needed a new solution.

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Several years ago, automotive supplier EFA France realised they were expanding at a rate beyond which their current electrical design setup could ...
E/E Design Process Evolution with MBSE
  • Blog
Januar 25, 2018
E/E Design Process Evolution with MBSE

This is an exciting time in the product development world. Increasing product complexity is driving the need for a design process evolution. Not long ago the detailed design process was the centerpiece of product development. But the need for functional and physical design accuracy is forcing the product development process to evolve. In response, the product development process is both converging and expanding.

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This is an exciting time in the product development world. Increasing product complexity is driving the need for a design process evolution. Not l...