EMV Probleme sind in der Leiterplatten-Konstruktionspraxis oft dafür verantwortlich, dass Re-Design-Zyklen notwendig werden. Aufgrund von immer kürzer Innovationszyklen von z.B. Mobiltelefonen oder IoT Applikationen wie Fitness-Trackern und vielen weiteren Elektronikprodukten sind diese zeitintensiven Re-Design-Zyklen unbedingt zu vermeiden.
Was tun, wenn Ihr nächstes Projekt besonders hohe EMV-Anforderungen stellt und schneller als jemals zuvor abgeschlossen werden muss?
What drives the features that are added or updated in a new release? The majority of the changes or additions in any Zuken tool release are customer-driven. Our customers provide valuable insight into emerging technologies, process and methodology changes, and the direction in which their EDA needs are taking them. This post focuses on the high points of the CR-8000 2020 release.
CR-8000 2020 is Zuken’s flagship PCB design platform, and I’m pleased to share some of the most exciting details of the new product release with you. But before we get into the new product release discussion, you may be wondering why we call it a platform and not a tool. CR-8000 2020 has all the bells and whistles for electronic subsystem development.
In the race to industry 4.0 consistent data is vital for successful digitalization. One of the biggest threats are data silos. Data silos describe the storage of data that remains under the control of one department. Therefore it is typically isolated from the rest of the organization or lives on network folders that have no access control, read-and-write or version control.
In today’s global value chains, data exchange and re-reuse are vital to support collaboration and productivity. But most data formats are proprietary. For any organization with an extensive database of ECAD data, the need for data migration will eventually arise.
Die Vorteile der Entwicklung aller Platinen eines Multi-Board Systems in einem durchgängigen System. Das so genannte Stacking von Platinen -das Stapeln von Leiterplatten als Alternative zur Verbindung über Kabeln - ist ein aktueller Trend, der die Herstellungskosten senken und die Zuverlässigkeit verbessern kann.
Double Data Rate 5 (DDR5) is the next-generation standard for random-access memory (RAM). The new specification promises to bring chips that have much higher performance than the existing DDR4 modules, as well as lower power consumption. Let us show you how you can be first to market with DDR5!
With every software release, you’ll find hundreds of enhancements, and CR-8000 Design Force 2019 is not an exception. Some are flashy and exciting, while others are, well, more utilitarian. But each and every one of them makes the product better. In this post, I’ll review my favorite 6 new routing enhancements in CR-8000 Design Force 2019.
To keep a good high-speed signal quality from driver to receiver on a PCB is not an easy task for designers. One of the most challenging issues is managing the propagation delay and relative time delay mismatches. Let me take you through the process...
What IC designers do to help us route high-speed PCBs
PCB designers typically have little or no experience with SPICE applications. No worries, follow along with me and get to know your SPICEs!
Do you know what a »Yogi-ism« is? Yogi-ism goes back to the name of the late Yogi Berra (1925 – 2015), an American professional baseball catcher, who was an 18-time All-Star and won 10 World Series championships – more than any other player in MLB history. After his career as a player, he turned to coaching, where he became famous for his “impromptu pithy comments, malapropisms, and seemingly unintentional witticisms, known as Yogi-isms”
Every day, more and more of our lives become connected with IoT technology. With billions of smart products already out there.
Did you know the expression ‘crosstalk’ stems from the days of telephone exchanges, as staffed by operators connecting parties who could sometimes and unintentionally hear someone else’s conversation? The talk was, literally, crossing over from one line to another.