Advanced IC Packaging analysis / verification, Physical PCB analysis
CR-8000 Design Force SoC/Package/PCB Co-Designer and Package Synthesizer, Zuken's Advanced IC Packaging extension to CR-5000 Board Designer, interfaces with Ansys's Maxwell, HFSS and Turbo Package Analyzer solutions for true RLCG reporting and 3D SPICE simulation.
The Zuken to Ansys interfacing provides:
- True 3D via structures for advanced build-up technologies and embedded components
- Stacked chip capability and die-to-die bonding
- True positive power plane representation versus the negative image approach
- S-Parameter data Interpolating sweep solving
- Critical net simulation ANF, NF1 & NF2 output.
ANSYS develops, markets and supports engineering simulation software used to foresee how product designs will behave and how manufacturing processes will operate in real-world environments. Ansys continually advance simulation solutions by, first, developing or acquiring the very best technology; then integrating it into a unified and customizable simulation platform that allows engineers to efficiently perform complex simulations involving the interaction of multiple physics; and, finally, providing system services to manage simulation processes and data — all so engineers and product developers can spend more time designing and improving products and less time using software and searching for data.
Engineering simulation is their sole focus. For more than 40 years, they have consistently advanced this technology to meet evolving customer needs.