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2012

  • Zuken Joins ODB++ Solutions Alliance

    Zuken has extended its OpenDoor agreement with Mentor Graphics by participating as a partner in the recently-formed ODB++ Solutions Alliance. The ODB++ Solutions Alliance provides a focal point for further technological development and adoption of the data format and comprises both users and solutions-development partners.

    (Released: 3 Apr 2012)

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  • Zuken's CR-8000 Design Force named a finalist in the prestigious UBM Electronics ACE Awards

    Zuken’s CR-8000 Design Force has been been named a finalist in the EE Times and EDN 2012 UBM Electronics ACE Awards, in the Software category. The awards program honors the people and companies behind the technologies and products that are changing the world of electronics.

    (Released: 22 Feb 2012)

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  • E³.WireWorks users join Zuken's E³.series global community

    Zuken today announced the release of a new version of its E³.WireWorks software – E³.WireWorks Unified – which is now a full part of Zuken’s complete E³.series solution. E³.WireWorks Unified now uses native E³.series files and provides users with access to modules that were previously only available in E³.series. E³.WireWorks users join Zuken’s E³.series global license community of more than 25,000 users.

    (Released: 7 Feb 2012)

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  • Zuken expands its international business team

    Zuken EAS has recently expanded its corporate business team to manage their growing business in Europe and North America. As part of this expansion, Steve Chidester has been appointed Head of International Marketing; a strategic role that will draw on Chidester’s 30-year experience in the electronic design industry to strengthen Zuken’s position as a leading vendor in the PCB systems and electrical design markets.

    (Released: 24 Jan 2012)

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  • MCAD and ECAD speak the same language with CADSTAR Board Modeler Lite

    Zuken announces a new version of Board Modeler Lite that offers significant productivity enhancements during board layout design. Board Modeler Lite 6.1 – available now with CADSTAR 13.0 – bridges the process between MCAD and ECAD design flows by offering a common platform to communicate between the two disciplines.

    (Released: 10 Jan 2012)

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2011

  • Increased design flexibility with CADSTAR 13.0 Constraint Browser and Topology Editor

    Zuken today announces increased flexibility for electronic engineers through CADSTAR’s Constraint Browser and Topology Editor. Constraint Browser is available now in CADSTAR 13.0. The application guides engineers through a fully integrated, constraints-driven design methodology to meet high-speed performance requirements, offering a fast and effective method to enter the most complex rules early in the design process.

    (Released: 7 Dec 2011)

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  • New Power Integrity Advance module launched for CADSTAR 13.0

    Zuken today announces a new tool for ensuring correct behavior of power distribution systems embedded within CADSTAR design flow, called Power Integrity Advance. Power Integrity Advance conducts EMC analysis and AC and DC power integrity analysis to help predict, analyze and control design issues that may cause problems later down the design process.

    (Released: 29 Nov 2011)

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  • Zuken shortens Intel embedded device schematic review time

    Zuken has developed an Electronic Design Interchange Format (EDIF) writer for Intel Schematic Review based on its electronic design automation (EDA) solutions. The EDIF writer shortens the time required to review circuits mounted in products in Intel’s embedded devices.

    (Released: 22 Nov 2011)

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  • Experience greater integration for collaboration with CADSTAR 13.0 release

    The latest release of CADSTAR version 13.0, Zuken’s PCB Design Software, will be available on November 9. In a tight market where PCB designers need to achieve more in the same amount of time, CADSTAR 13.0 offers an unprecedented level of new, user-driven functionality.

    (Released: 8 Nov 2011)

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  • Zuken announces the first system-level PCB design environment

    Zuken today announces its new IC package and PCB design and analysis solution called Design Force. The design solution is the only one of its kind that enables single board, multi-board, and chip-package-board interconnect optimization in native 3D.

    (Released: 25 Oct 2011)

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